Microtechnology

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Process Technology
  • Melt and burr free precision machining with short-pulse laser (ns-, ps-, fs-Laser)
  • Processing of transparent and brittle materials with UV and VUV laser
  • Excimer and frequency converted solid state laser(157 nm - 355 nm)
  • µm and sub-µm resoltion
  • Process technologies:
      - drilling   - cutting   - 3D - structuring
      - surface modification   - µ-stereolithography   - µ-welding
  • Broad variety of materials:
      - metals   - ceramics   - glass
      - semiconductors   - polymers   - crystaline materials

Applications

Microstereolithography

Cutting

Burr and melt free, arbitrary 3D cutting		 Drilling

High precision, high aspect ratio, minimized thermal impact		 Structuring

2.5-dimensional surfaces in brittle materials		 Stereolithography

Generation of arbitary 3D structures
Microsystem Technology

Slot cutting in silicon for inkjet printer nozzles		 Electronics

Laser welding of electronic components on polymer substrates		 Surface Modification

Designed wettability from hydrophobic to hydrophilic
Sensor

Trimming of gyrometer sensors for anti skidding control		Medicine

Bio-degradable stent, machined with a femtosecond laser		 Automotive

Spry hole of injection nozzle, drilled with a femtosecond laser

Service
  • Fundamental research
  • Feasibility studies
  • Process development
  • Manufacturing solutions
  • System design and realisation
  • Consulting
 Process
 Design
 Realisation

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